HC28 is over. Thanks to all our attendees, presenters, corporate sponsors, flint center and volunteers for making it happen.
Entire HC28 Tutorials, Conference & Posters: hc28_archive.zip
(All files and links updated as of: Wed Aug 24 19:52:01 PDT 2016)
Tutorial 2: 3D Depth for Consumers: From Sensors to Apps
Session 1: GPUs and HPC Processors
Session 2: Processing on the Go: Mobile Devices
Session 3: Energy-Efficient Computing: Low-Power SoCs
Session 4: Vision and Image Processing
Session 5: Interconnects: Microns to Kilometers
Session 6: Emerging Embedded
Keynote 2: Are We There Yet? Silicon in Self-Driving Cars.
Session 7: Many-Core Chips
Session 8: Dealing with Big Data
Session 9: High-Performance Processors
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- Sunday 8/21: Tutorials
- 8:00 AM – 9:00 AM: Breakfast
- 9:00 AM – 12:30 PM: Tutorial 1: Using Next-Generation Memory Technologies: DRAM and Beyond
- 12:30 PM – 1:45 PM: Lunch
- 1:45 PM – 5:00 PM: Tutorial 2: 3D Depth for Consumers: From Sensors to Apps
- 5:00 PM – 6:00 PM: Reception
- Monday 8/22: Conference Day 1
- 8:30 AM – 9:30 PM: Breakfast
- 9:30 AM – 9:45 PM: Introduction
- 9:45 AM – 11:15 AM: GPUs and HPC Processors
- 11:15 AM – 11:45 AM: Break
- 11:45 AM – 12:45 PM: Processing on the Go: Mobile Devices
- 12:45 PM – 2:15 PM: Lunch
- 2:15 PM – 3:00 PM: Keynote 1: Mixed Reality
- 3:00 PM – 4:00 PM: Energy-Efficient Computing: Low-Power SoCs
- 4:00 PM – 4:30 PM: Break
- 4:30 PM – 6:00 PM: Vision and Image Processing
- 6:00 PM – 7:00 PM: Reception
- Tuesday 8/23: Conference Day 2
- 7:30 AM – 8:30 AM: Breakfast
- 8:30 AM – 10:00 AM: Interconnects: Microns to Kilometers
- 10:00 AM – 10:30 AM: Break
- 10:30 AM – 12:00 PM: Emerging Embedded
- 12:00 PM – 1:15 PM: Lunch
- 1:15 PM – 2:15 PM: Keynote 2: Are We There Yet? Silicon in Self-Driving Cars.
- 2:15 PM – 3:15 PM: Many-Core Chips
- 3:15 PM – 3:45 PM: Break
- 3:45 PM – 5:15 PM: Dealing with Big Data
- 5:15 PM – 5:45 PM: Break
- 5:45 PM – 7:15 PM: High-Performance Processors
- 7:15 PM – 7:30 PM: Closing Remarks
Tutorials
| Sun 8/21 | Tutorial | Title | Presenter | Affiliation |
| 8:00 AM | Breakfast | |||
| Tutorial 1: Using Next-Generation Memory Technologies: DRAM and Beyond Abstract: Memory technologies such as DRAM are rapidly changing from traditional interfaces and DRAM based devices to new interfaces, packages and device technologies. This tutorial will describe new technologies from industry leading memory vendors and show how they are used in new and emerging products and applications. |
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| 9:00 AM | Tutorial 1 | Introduction | Vidya Rajagopalan | |
| 9:10 AM | Memory as We Approach a New Horizon | Thomas Pawlowski | Micron Technology | |
| 9:45 AM | The Future of Graphic and Mobile Memory for New Applications | Jin Kim | Samsung | |
| 10:15 AM | Break | |||
| 10:35 AM | The Era of High Bandwidth Memory | Kevin Tran | SK Hynix | |
| 11:10 AM | HBM Package Integration: Technology Trends, Challenges and Applications | Suresh Ramalingam | Xilinx | |
| 11:45 AM | Memory Technology and Applications | Allen Rush | AMD | |
| 12:15 PM | Q & A Panel | All | ||
| 12:30 PM | Lunch | |||
| Tutorial 2: 3D Depth for Consumers: From Sensors to Apps Abstract: 3D depth sensors are becoming increasingly ubiquitous, moving from robots and factories into cars and phones. Learn how sensor manufacturers, vision processing companies and application developers are enabling new depth – powered experiences for consumers. |
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| 1:45 PM | Tutorial 2 | Intro: 3D Sensors for the Rest of Us | Larry Yang | |
| 2:00 PM | VR and AR Anytime and Everywhere: Contributions of PMD Depth Sensing to an Evolving Ecosystem | Bernd Buxbaum | PMD Tech | |
| 2:30 PM | “Speaking in Volumes”: Volumetric Data Acceleration for Dense SLAM | David Moloney | Movidius | |
| 3:00 PM | Inuitive Breakthrough Solution for AR and VR Worlds | Dor Zepeniuk | Inuitive | |
| 3:30 PM | Break | |||
| 4:00 PM | 3D Reconstruction for Consumer Mobile Devices | Ivan Dryanovsk | ||
| 4:30 PM | Mobile 3D Capture for Professional Applications | Rafael Spring | DotProduct | |
| 5:00 PM | Reception | |||
| 6:00 PM | End of Reception | |||
Conference Day1
| Mon 8/22 | Session | Title | Presenter | Affiliation |
| 8:30 AM | Breakfast | |||
| 9:30 AM | Welcome | Introductory Remarks | Stefan Rusu | HC28 General Chair |
| 9:45 AM | GPUs & HPCs | Bifrost, the new GPU architecture and its initial implementation, Mali-G71 | Jem Davies | ARM |
| Ultra-Performance Pascal GPU and NVLink Interconnect | Denis Foley | NVIDIA | ||
| ARMv8-A Next Generation Vector Architecture for HPC | Nigel Stephens | ARM | ||
| 11:15 AM | Break | |||
| 11:45 AM | Mobile | Helio X20: The First Tri-Gear Mobile SoC with CorePilotTM 3.0 Technology | David Lee | Mediatek |
| Samsung’s Exynos-M1 CPU | Brad Burgess | Samsung | ||
| 12:45 PM | Lunch | |||
| 2:15 PM | Keynote 1 | Mixed Reality | Nick Baker | Microsoft |
| Abstract: The Microsoft HoloLens is an untethered holographic computer that transforms ways we communicate, create, and explore. It creates high-definition, 3D holograms using advanced nano-optics and micro displays. These become part of the real world through on-board processing of data from an array of sensors continuously sampling the user’s environment. HoloLens combines all of the processing and components in a form factor that enables interaction with the real and the virtual in a most natural way. | ||||
| 3:00 PM | Low Power SoC | Design and Development of a an Ultra-Low Power x86 MCU Class SoCs | Peter Barry | Intel |
| NVIDIA Tegra-Next System-on-Chip | Andi Skende | NVIDIA | ||
| 4:00 PM | Break | |||
| 4:30 PM | Vision & Imaging | From Model to FPGA: Software-Hardware Co-Design for Efficient Neural Network Acceleration | Song Yao | Deephi and Tsinghua University |
| The path to Embedded Vision and AI using a low power Vision DSP | Yair Siegel | CEVA | ||
| High Performance DSP for Vision, Imaging and Neural Networks | Greg Efland | Cadence | ||
| 6:00 PM | Reception | |||
| 7:00 PM | End of Reception |
Conference Day2
| Tue 8/23 | Session | Title | Presenter | Affiliation |
| 7:30 AM | Breakfast | |||
| 8:30 AM | Interconnects | A 16nm 256-bit Wide 89.6GByte/s Total Bandwidth In-Package Interconnect with 0.3V Swing and 0.062pJ/bit Power in InFO Package | Mu-Shan Lin | TSMC |
| 100Gbit/s, 120km, PAM 4 Based Switch to Switch, Layer 2 Silicon Photonics based Optical Interconnects for Datacenters | Radhakrishnan Nagarajan, Sudeep Bhoja | InPhi | ||
| Intel Omni-Path 4.8 Tbps Switch ASIC and Platform | James Kunz | Intel | ||
| 10:00 AM | Break | |||
| 10:30 AM | Emerging Embedded | A “Zero-displacement” Active Ultrasonic Force Sensor for Mobile Applications | Sam Sheng | Sentons |
| Quantum Dot-Based Imagers for Multispectral Cameras and Sensors | Emanuele Mandelli | Invisage | ||
| Building the World’s First Super Active Suspension System | Shakeel Avadhany | Levant | ||
| 12:00 PM | Lunch | |||
| 1:15 PM | Keynote 2 | Are We There Yet? Silicon in Self-Driving Cars. | Daniel Rosenband | |
| Abstract: Self-driving cars present a challenge in perceiving and interpreting information in a constantly changing environment. This keynote talk highlights these challenges and how silicon is a core enabler for self-driving compute and sensing technologies. | ||||
| 2:15 PM | Multicore Research | Piton: A 25-core Academic Manycore Processor | Michael McKeown | Princeton University |
| KiloCore: A 32 nm 1000-Processor Array | Brent Bohnenstiehl | UC Davis | ||
| 3:15 PM | Break | |||
| 3:45 PM | Dealing w/ Big Data | Embedded Deep Neural Networks: “the cost of everything and the value of nothing” | David Moloney | Movidius |
| Software in Silicon in the Oracle SPARC M7 processor | Kathirgamar Aingaran and David Lutz | Oracle | ||
| SDA: Software-Defined Accelerator for General-Purpose Distributed Big Data Analysis System | Jian Ouyang | Baidu | ||
| 5:15 PM | Break | |||
| 5:45 PM | Processors | Inside 6th generation Intel Core code named Skylake:: New Microarchitecture and Power Management | Jack Doweck | Intel |
| POWER9: Processor for the Cognitive Era | Brian Thompto | IBM | ||
| A New, High Performance x86 Core Design from AMD | Michael Clark | AMD | ||
| 7:15 | Closing Remarks | |||
| 7:30 | Conference Ends |
Posters
| Title | Presenter |
| An Intelligent ADAS Processor with Real-Time Semi-Global Matching and Intention Prediction for 720p Stereo Vision | Kyuho J. Lee, Kyeongryeol Bong, Changhyeon Kim, and Hoi-Jun Yoo of Korea Advanced Institute of Science and Technology (KAIST) |
| Deep Compression and EIE: Efficient Inference Engine on Compressed Deep Neural Network | Song Han*, Xingyu Liu, Huizi Mao, Jing Pu, Ardavan Pedram, Mark Horowitz, Bill Dally of Stanford |
| QORIQ® LS1012A:Big things in Small Packages: 64-Bit Core in a sub-10MM Package | Ben Eckermann of NXP |
| A Dynamically Scheduled Architecture for the Synthesis of Graph Methods |
Marco Minutoli*, Vito Giovanni Castellana*, Antonino Tumeo*, Marco Lattuada+, Fabrizio Ferrandi+ of *High Performance Computing, Pacific Northwest National Laboratory, +DEIB, Politecnico di Milano |
| LiveSynth: Towards an Interactive Synthesis Flow | Rafael Trapani Possignolo, Jose Renau of University of California, Santa Cruz |
| Modularizing the Microprocessor Core to Outperform Traditional Out-of-Order | Tony Nowatzki Karthikeyan Sankaralingam of University of Wisconsin – Madison |
| Encoder Logic for Reducing Serial I/O Power in Sensors and Sensor Hubs | Phillip Stanley-Marbell and Martin Rinard of MIT |
| Experiences Using a Novel Python-Based Hardware Modeling Framework for Computer Architecture Test Chips(paper)(slides) | Christopher Torng of Cornell University |
| Reconfigure Your RTL with EFLX | Cheng C. Wang and Dejan Marković of Flexlogix Technologies |
| Task Parallel Programming Model + Hardware Acceleration = Performance Advantage | Tamer Dallou1, Cesar Divino Lucas2, Guido Araujo2, Lucas Morais2, Eduardo Ferreira Barbosa2, Michael Frank3, Richard Bagley3, Raj Sayana3 of 1 LG Electronics Technology Center Europe, 2University of Campinas, Brazil (Unicamp), 3LG Electronics Mobile Research, San Jose Lab |
| NOSQL Hardware appliance with Multiple Data Structure | Yuta Tokusashi, Hiroki Matsutani of Keio University |
| AnyCore-1: A Comprehensively Adaptive 4-Way Superscalar Processor | Rangeen Basu Roy Chowdhury, Anil K. Kannepalli, Eric Rotenberg of North Carolina State University |
| MvEcho – Acoustic Response Modelling for Auralisation(poster)(slides) | Léonie Buckley, Sam Caulfield, David Moloney of Movidius Ltd. |
| Passive Dense Stereo Vision On The Myriad2 VPU | Luca Puglia 1 Mircea Ionic ˘a 2 Giancarlo Raiconi 1 David Moloney 2 of 1 Universita’ degli Studi di Salerno, 2 Movidius Ltd. |